HyunSeop Lee: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Slurry components in metal chemical mechanical planarization (CMP) process: A review

Lee, Dasol, Lee, Hyunseop, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2016

Language:

english

File:

PDF, 776 KB

english, 2016

2

Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction

Son, Jungyu, Lee, Hyunseop

Journal:

Year:

2020

File:

PDF, 8.14 MB

2020

3

Temperature distribution in polishing pad during CMP process: Effect of retaining ring

Hyunseop Lee, Yongchang Guo, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2012

Language:

english

File:

PDF, 1.52 MB

english, 2012

4

A wafer-scale material removal rate profile model for copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong

Journal:

International Journal of Machine Tools and Manufacture

Year:

2011

Language:

english

File:

PDF, 1.61 MB

english, 2011

5

Effect of pad groove geometry on material removal characteristics in chemical mechanical polishing

Yongchang Guo, Hyunseop Lee, Youngkyun Lee, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2012

Language:

english

File:

PDF, 10.21 MB

english, 2012

6

Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304)

Kim, Taekyoung, Lee, Hyunseop

Journal:

Year:

2020

File:

PDF, 6.79 MB

2020

7

Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

Boumyoung Park, Hyunseop Lee, Kihyun Park, Hyoungjae Kim, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2008

Language:

english

File:

PDF, 989 KB

english, 2008

8

Influence of slurry components on uniformity in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 841 KB

english, 2008

9

Effect of mechanical factor in uniformity for electrochemical mechanical planarization

Sukhoon Jeong, Jaehyun Bae, Hyunseop Lee, Hojun Lee, Youngkyun Lee, Boumyoung Park, Hyoungjae Kim, Sungryul Kim, Haedo Jeong

Journal:

Sensors and Actuators A: Physical

Year:

2010

Language:

english

File:

PDF, 1.42 MB

english, 2010

10

Chemical mechanical planarization of copper bumps on printed circuit board

MoonKi Jeong, SeungJae Jo, HyunSeop Lee, AhReum Lee, ChungYun Kang, JinWon Choi, JinHo Kim, HaeDo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2011

Language:

english

File:

PDF, 272 KB

english, 2011

11

Evaluation of environmental impacts during chemical mechanical polishing (CMP) for sustainable manufacturing

Hyunseop Lee, Sunjoon Park, Haedo Jeong

Journal:

Journal of Mechanical Science and Technology

Year:

2013

Language:

english

File:

PDF, 1.43 MB

english, 2013

12

The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption

Lee, Dasol, Lee, Hyunseop, Jeong, Haedo

Journal:

Journal of Mechanical Science and Technology

Year:

2015

Language:

english

File:

PDF, 2.66 MB

english, 2015

13

Mechanical aspects of the chemical mechanical polishing process: A review

Lee, Hyunseop, Lee, Dasol, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2016

Language:

english

File:

PDF, 1021 KB

english, 2016

14

Mathematical modeling of material removal rate in roll-type linear CMP (roll-CMP) process: Effect of polishing pad

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2016

Language:

english

File:

PDF, 533 KB

english, 2016

15

Prediction of Real Contact Area from Microtopography on CMP Pad

JEONG, Hobin, LEE, Hyunseop, CHOI, Sungha, LEE, Youngkyun, JEONG, Haedo

Journal:

Journal of Advanced Mechanical Design Systems and Manufacturing

Year:

2012

Language:

english

File:

PDF, 1.83 MB

english, 2012

16

[IEEE 2020 International Conference on Electronics, Information, and Communication (ICEIC) - Barcelona, Spain (2020.1.19-2020.1.22)] 2020 International Conference on Electronics, Information, and Communication (ICEIC) - Simulation on Polishing Pad Wear in CMP Conditioning with Split Conditioner Disk

Year:

2020

File:

PDF, 483 KB

2020

17

Simulation and experimental analysis of abrasive fluidized bed machining process

Kim, Taekyoung, Lee, Hyunseop

Journal:

Journal of Mechanical Science and Technology

Year:

2020

File:

PDF, 1.86 MB

2020

18

Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization

Sukhoon Jeong, Hyunseop Lee, Hanchul Cho, Sangjik Lee, Hyoungjae Kim, Sungryul Kim, Jaehong Park, Haedo Jeong

Journal:

Applied Surface Science

Year:

2010

Language:

english

File:

PDF, 1.13 MB

english, 2010

19

Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard–brittle materials used in light-emitting diodes

Hyunseop Lee, Hiroshi Kasuga, Hitoshi Ohmori, Hojun Lee, Haedo Jeong

Journal:

Journal of Crystal Growth

Year:

2011

Language:

english

File:

PDF, 2.03 MB

english, 2011

20

Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2009

Language:

english

File:

PDF, 978 KB

english, 2009

21

Mechanical effect of colloidal silica in copper chemical mechanical planarization

Hyunseop Lee, Sukbae Joo, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2009

Language:

english

File:

PDF, 1.30 MB

english, 2009

22

Granzyme B leakage-induced apoptosis is a crucial mechanism of cell death in nasal-type NK/T-cell lymphoma

Ko, Young-Hyeh, Park, Sanghui, Jin, Heekyung, Woo, Heesook, Lee, Hyunseop, Park, Chaewha, Kim, Kihyun

Journal:

Laboratory Investigation

Year:

2007

Language:

english

File:

PDF, 412 KB

english, 2007

23

Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

Lee, Hyunseop, Dornfeld, David Alan, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2014

Language:

english

File:

PDF, 404 KB

english, 2014

24

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

Lee, Hyunseop, Park, Yeongbong, Lee, Sangjik, Jeong, Haedo

Journal:

Journal of Mechanical Science and Technology

Year:

2013

Language:

english

File:

PDF, 611 KB

english, 2013

25

Effect of contact angle between retaining ring and polishing pad on material removal uniformity in CMP process

Park, Yeongbong, Lee, Hyunseop, Lee, Youngkyun, Park, Sunjoon, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2013

Language:

english

File:

PDF, 684 KB

english, 2013

26

Preliminary study on the effect of spray slurry nozzle in CMP for environmental sustainability

Lee, Hyunseop, Park, Yeongbong, Lee, Sangjik, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2014

Language:

english

File:

PDF, 813 KB

english, 2014

27

Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system

Lee, Hyunseop, Wang, Han, Park, Jaehong, Jeong, Haedo

Journal:

Precision Engineering

Year:

2014

Language:

english

File:

PDF, 2.54 MB

english, 2014

28

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Low Power Noise Multilayer PCB with Discrete Decoupling Capacitors Inside

Song, Ki-Jae, Kim, Jongmin, Yoo, Jongwoon, Nah, Wansoo, Lee, Jaeil, Sim, Hyunseop

Year:

2008

Language:

english

File:

PDF, 4.55 MB

english, 2008

29

Effect of heat according to wafer size on the removal rate and profile in CMP process

Yeongbong Park,Youngkyun Lee,Hyunseop Lee,Haedo Jeong

Journal:

Electronic Materials Letters

Year:

2013

Language:

english

File:

PDF, 585 KB

english, 2013

30

Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing

Park, Boumyoung, Lee, Hyunseop, Kim, Youngjin, Kim, Hyoungjae, Jeong, Haedo

Journal:

Japanese Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 175 KB

english, 2008

31

Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing

Park, Boumyoung, Jeong, Sukhoon, Lee, Hyunseop, Kim, Hyoungjae, Jeong, Haedo, Dornfeld, David A.

Journal:

Japanese Journal of Applied Physics

Year:

2009

Language:

english

File:

PDF, 400 KB

english, 2009

32

Macroscopic and Microscopic Investigation on Chemical Mechanical Polishing of Sapphire Wafer

Lee, Hyunseop, Lee, Hojun, Jeong, Hobin, Choi, Sungha, Lee, Youngkyun, Jeong, Moonki, Jeong, Haedo

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2012

Language:

english

File:

PDF, 1.42 MB

english, 2012

33

[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - A study on swing-arm conditioning for enhancing pad lifetime in CMP

Lee, Hyunseop, Lee, Dasol, Jeong, Haedo, Lee, Sangjik

Year:

2014

Language:

english

File:

PDF, 388 KB

english, 2014

34

Low‐power noise multilayer PCB with discrete decoupling capacitors inside

Song, Ki‐Jae, Kim, Jongmin, Yoo, Jongwoon, Nah, Wansoo, Lee, Jaeil, Sim, Hyunseop

Journal:

Year:

2009

Language:

english

File:

PDF, 294 KB

english, 2009

35

Development of green CMP by slurry reduction through controlling platen coolant temperature

Yuh, Minjong, Jang, Soocheon, Kim, Hyoungjae, Lee, Hyunseop, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2015

Language:

english

File:

PDF, 714 KB

english, 2015

36

Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal

Lee, Hyunseop, Lee, Sangjik

Journal:

Precision Engineering

Year:

2017

Language:

english

File:

PDF, 4.38 MB

english, 2017

37

Environmental impact of concentration of slurry components in thick copper CMP

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2017

Language:

english

File:

PDF, 1.72 MB

english, 2017

38

Estimating the mechanical properties of polyurethane-impregnated felt pads

Lee, Dasol, Lee, Hyunseop

Journal:

Journal of Mechanical Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.96 MB

english, 2017

39

Electrochemical Analysis of the Slurry Composition for Chemical Mechanical Polishing of Flexible Stainless-Steel Substrates

Lee, Dasol, Kim, Hyunjin, Pak, Byeongjun, Kim, Doyeon, Jeong, Haedo, Lee, Hyunseop

Journal:

Journal of Friction and Wear

Year:

2017

Language:

english

File:

PDF, 812 KB

english, 2017

40

Experimental study on reversible formation of 2D flocs from plate-like particles dispersed in Newtonian fluid under torsional flow

Lee, Hyunseop, Kim, Chongyoup

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Year:

2018

Language:

english

File:

PDF, 6.68 MB

english, 2018

41

Toxic megacolon and interstitial pneumonia caused by cytomegalovirus infection in a pediatric patient with acute lymphoblastic leukemia receiving chemotherapy

Kwon, Hyunseop, Lee, Hyun Hee, Paik, Chung Ryul, Lim, Yun-Jeong, Park, Jeong A.

Journal:

Year:

2016

Language:

english

File:

PDF, 1.23 MB

english, 2016

42

Surface Activation by Electrolytically Ionized Slurry during Cu CMP

Lee, Dasol, Lee, Hyunseop, Jeong, Seonho, Yuh, Minjong, Jeong, Haedo

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.04 MB

2019

43

Surface Activation by Electrolytically Ionized Slurry during Cu CMP

Lee, Dasol, Lee, Hyunseop, Jeong, Seonho, Yuh, Minjong, Jeong, Haedo

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.04 MB

english, 2019

44

Semi-empirical Material Removal Model with Modified Real Contact Area for CMP

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2019

Language:

english

File:

PDF, 2.06 MB

english, 2019

45

Study on Coagulation Kinetics of Disk-like Particles under Simple Shear Flow

Lee, Hyunseop, Kim, Chongyoup

Journal:

Year:

2019

Language:

english

File:

PDF, 1.42 MB

english, 2019

46

Study on Coagulation Kinetics of Disk-like Particles under Simple Shear Flow

Lee, Hyunseop, Kim, Chongyoup

Journal:

Year:

2019

File:

PDF, 1.42 MB

2019

47

[IEEE 2019 IEEE International Conference on Big Data (Big Data) - Los Angeles, CA, USA (2019.12.9-2019.12.12)] 2019 IEEE International Conference on Big Data (Big Data) - A Framework for Identifying and Prioritizing Data Analytics opportunities in Additive Manufacturing

Park, Hyunseop, Ko, Hyunwoong, Lee, Yung-Tsun T., Cho, Hyunbo, Witherell, Paul

Year:

2019

Language:

english

File:

PDF, 3.08 MB

english, 2019